Supreme Circuits is equipped with a wide range of advanced technical capabilities, enabling us to produce high-quality PCBs with precision and reliability. Below are the detailed specifications of our technical capabilities:

Technical Capabilities

Multilayer PCB

Max No of layer	12
Max Board Size(mm)	415mm x 585mm
Board Thickness(mm)	0.4 mm to 3.20 mm
Base Material	FR4, High TG (on Demand)
Inner Layer Copper Cladding	Max. Cu wt. for Planes 70μ Max. Cu wt. for Signals 70μ Min. Cu wt. 18μ
Circuit Layer (in mm) Inner Layer	For start copper thickness of 18μ min Track Width - 0.15mm (6 mil) min track spacing - 0.15mm (6 mil) For start copper thickness of 35μ min Track Width - 0.20mm min track spacing - 0.20mm For start copper thickness of 70μ min Track Width - 0.25mm min track spacing - 0.25mm
Drilling
Blind and Buired vias manufacturable Yes Drill to track Clearance for inner layer (upto 6 Layers) 0.30 mm Drill to Track clearance for inner layer ( > 6 Layers) 0.40 mm
Layer Construction
Min. Core Thickness 0.15 mm Min. Dielectric thickness 0.15 mm
Copper Cladding
Max. Copper thickness 140μ Min. Copper thickness 35μ

Single Side / Double Side PCB

Max Board Size(mm)	600mm x 1200mm
Board Thickness(mm)	0.20, 0.4, 0.6, 0.8, 1.00, 1.6, 2.4, 3.2
Min Finished Board	0.20mm
Base Material	FR4, High TG and Rogers (on Demand)
Circuit Layer (in mm)	For start copper thickness of 18μ min Track Width - 0.15mm (6 mil) min track spacing - 0.15mm (6 mil) For start copper thickness of 35μ min Track Width - 0.20mm min track spacing - 0.20mm For start copper thickness of 70μ min Track Width - 0.25mm min track spacing - 0.25mm

Copper Cladding

Max. Copper thickness	140μ
Min. Copper thickness	35μ

Drilling (All Values are in mm) for Single/Double/Multilayer

Sr	Specification
a)	Min. finished via hole size	0.20mm
b)	Min. finished via pad size	0.50mm
c)	Min. annular ring	0.15mm
d)	Drill to drill clearance	0.20mm
e)	Min. slot size for PTH slots (Tool size)	0.70mm
g)	Min. drill size for plated holes on board edge	0.80mm
h)	Min. drill to drill clearance for plated holes on board edge	0.80mm

Surface Finish

Sr	Specification	Availability
a)	HAL (Leaded & Lead free)	YES
b)	Electrolytic Gold / Nickel	YES
c)	Electroless Nickle / Gold	YES
d)	Immersion Silver	YES
e)	Immersion Tin	YES
f)	SMOBC with OSP	YES

Solder Mask

Sr	Specification	Availability
a)	Mask opening	0.2 mm
b)	Min. soldermask web width between pads	0.2 mm
e)	SM to trace clearance	0.10 mm
f)	Via fill max drill size	0.40 mm
g)	Mask Color availability	Green, Black, White, Blue, Red

Legend

Sr	Specification	Value
a)	Legend line width	0.15 mm to 0.20 mm
b)	Min. character height	1.00 mm

Scoring

Sr	Specification	Value
a)	Angle for v-cut	30 degree
b)	Jump scoring	Yes

Routing

Sr	Specification	Value
a)	Min. router size	0.80 mm

Copper Clearance from PCB Edge

Sr	Specification	Value
a)	For routing	0.4 mm
b)	For scoring	0.5 mm
c)	For inner layer	0.5 mm

Carbon

Sr	Specification	Value
a)	Min. line width	0.30 mm
b)	Min. carbon – carbon spacing	0.25 mm

Peelable

Sr	Specification	Value
a)	Minimum width of any Peel-off element	1.00 mm
b)	Maximum coverable hole ENDSIZE	4.00 mm

Drill Tolerances

PTH Hole Size	PTH Tolerance	NPTH Hole Size	NPTH Tolerance
0.50-3.50 mm	+/- 0.075 mm	<3 mm	+/- 0.05 mm
>3.50 mm	+/- 0.10mm	>3 mm	+/- 0.10 mm

Other Tolerances

PCB Size	+/- 0.20 mm
PCB Thickness	+/- 20% (Up to 0.8 mm thickness) +/- 10% (Above 1.0 mm thickness)
Trace Width / Spacing	+/- 10 %
Copper Thickness Inside Hole	>= 20 um
Bow & twist tolerance	+/- 1%