F-46, Okhla Ind. Area, Phase – I,
New Delhi – 110020, INDIA
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Supreme Circuits has been facilitated with different types of technical capabilities, enabling the company competent in producing the products with excellent quality. Following are the details of our technical capabilities:

Technical Capabilities


Multilayer PCB

Max No of layer 12
Max Board Size(mm) 415mm x 585mm
Board Thickness(mm) 0.4 mm to 3.20 mm
Base Material FR4, High TG (on Demand)
Inner Layer Copper Cladding
Max. Cu wt. for Planes 70μ
Max. Cu wt. for Signals 70μ
Min. Cu wt. 18μ
Circuit Layer (in mm) Inner Layer
For start copper thickness of 18μ min Track Width - 0.15mm (6 mil)
min track spacing - 0.15mm (6 mil)
For start copper thickness of 35μ min Track Width - 0.20mm
min track spacing - 0.20mm
For start copper thickness of 70μ min Track Width - 0.25mm
min track spacing - 0.25mm
Drilling
Blind and Buired vias manufacturable Yes
Drill to track Clearance for inner layer (upto 6 Layers) 0.30 mm
Drill to Track clearance for inner layer ( > 6 Layers) 0.40 mm
Layer Construction
Min. Core Thickness 0.15 mm
Min. Dielectric thickness 0.15 mm
Copper Cladding
Max. Copper thickness 140μ
Min. Copper thickness 35μ

Single Side / Double Side PCB

Max Board Size(mm) 600mm x 1200mm
Board Thickness(mm) 0.20, 0.4, 0.6, 0.8, 1.00, 1.6, 2.4, 3.2
Min Finished Board 0.20mm
Base Material FR4, High TG and Rogers (on Demand)
Circuit Layer (in mm)
For start copper thickness of 18μ min Track Width - 0.15mm (6 mil)
min track spacing - 0.15mm (6 mil)
For start copper thickness of 35μ min Track Width - 0.20mm
min track spacing - 0.20mm
For start copper thickness of 70μ min Track Width - 0.25mm
min track spacing - 0.25mm
Copper Cladding
Max. Copper thickness 140μ
Min. Copper thickness 35μ

Drilling (All Values are in mm) for Single/Double/Multilayer

Sr Specification
a) Min. finished via hole size 0.20mm
b) Min. finished via pad size 0.50mm
c) Min. annular ring 0.15mm
d) Drill to drill clearance 0.20mm
e) Min. slot size for PTH slots (Tool size) 0.70mm
g) Min. drill size for plated holes on board edge 0.80mm
h) Min. drill to drill clearance for plated holes on board edge 0.80mm

Surface Finish

Sr Specification Availability
a) HAL (Leaded & Lead free) YES
b) Electrolytic Gold / Nickel YES
c) Electroless Nickle / Gold YES
d) Immersion Silver YES
e) Immersion Tin YES
f) SMOBC with OSP YES

Solder Mask

Sr Specification Availability
a) Mask opening 0.2 mm
b) Min. soldermask web width between pads 0.2 mm
e) SM to trace clearance 0.10 mm
f) Via fill max drill size 0.40 mm
g) Mask Color availability Green, Black, White, Blue, Red

Legend

Sr Specification Value
a) Legend line width 0.15 mm to 0.20 mm
b) Min. character height 1.00 mm

Scoring

Sr Specification Value
a) Angle for v-cut 30 degree
b) Jump scoring Yes

Routing

Sr Specification Value
a) Min. router size 0.80 mm

Copper Clearance from PCB Edge

Sr Specification Value
a) For routing 0.4 mm
b) For scoring 0.5 mm
c) For inner layer 0.5 mm

Carbon

Sr Specification Value
a) Min. line width 0.30 mm
b) Min. carbon – carbon spacing 0.25 mm

Peelable

Sr Specification Value
a) Minimum width of any Peel-off element 1.00 mm
b) Maximum coverable hole ENDSIZE 4.00 mm

Drill Tolerances

PTH Hole Size PTH Tolerance NPTH Hole Size NPTH Tolerance
0.50-3.50 mm +/- 0.075 mm <3 mm +/- 0.05 mm
>3.50 mm +/- 0.10mm >3 mm +/- 0.10 mm

Other Tolerances

PCB Size +/- 0.20 mm
PCB Thickness +/- 20% (Up to 0.8 mm thickness)
+/- 10% (Above 1.0 mm thickness)
Trace Width / Spacing +/- 10 %
Copper Thickness Inside Hole >= 20 um
Bow & twist tolerance +/- 1%